PURPOSE: To provide a wafer inspecting device which can sharply simplify a wafer inspecting method and, at the same time, can improve the production efficiency by eliminating futilities in a wafer manufacturing process.
CONSTITUTION: In the middle of a polishing process for polishing the surface of a wafer 4 opposite to the stuck and fixed surface of the wafer 4 while the wafer 4 is stuck and fixed to a plate 5, the plate 5 is removed together with the wafer 4 stuck and fixed to the plate 5 and the wafer 4 is dipped in water together with the plate 5 with the polished surface of the wafer 4 upward. While the wafer 4 is dipped in the water, the surface of the wafer is observed under a differential interference microscope 12. Since the surface of the wafer 4 can be observed under the microscope 12 while the wafer 4 is stuck to the plate 5 in the middle of the polishing process, the labor and time required by the conventional inspecting work for removing, washing, and drying the wafer 4 to be inspected can be eliminated and the occurrence of new surface abnormality and scratches on the surface of the wafer 4 can be prevented. At the same time, the production efficiency of the wafer 4 can be improved by eliminating uselessness from the manufacturing process of the wafer.
OKADA MAMORU
OKI YOSHI
NAGANO ELECTRONICS IND