Title:
WAFER-LIKE OBJECT HANDLING DEVICE
Document Type and Number:
Japanese Patent JPH09186218
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve productivity based on standard mechanical interface (SMIF) conditions, provide a carrier path which may be freely selected, reduce costs for machines, and ensure high positioning accuracy. SOLUTION: A wafer-like object handling device includes at least one index unit for supplying and receiving an object at supplying and receiving positions located within a handling plane, and at least one carrier unit for transporting a wafer-like object between the supplying and receiving positions and a work station. A work station 12 is located to be substantially concentric with the center point together with at least one other work station 13, 14. The handling device further includes an exchange unit 11 having a rotation axis X-X extending through the center point.
Inventors:
KURAUSU SHIYURUTSU
HARARUDO BETSUKERUTO
BERUNTO RAANE
MANFURETSUDO HAINTSUE
HARARUDO BETSUKERUTO
BERUNTO RAANE
MANFURETSUDO HAINTSUE
Application Number:
JP15795596A
Publication Date:
July 15, 1997
Filing Date:
June 19, 1996
Export Citation:
Assignee:
JENOPTIK JENA GMBH
International Classes:
B65G1/00; H01L21/00; H01L21/677; (IPC1-7): H01L21/68; B65G1/00
Domestic Patent References:
| JPH05331642A | 1993-12-14 | |||
| JPH03177041A | 1991-08-01 | |||
| JPS63143833A | 1988-06-16 | |||
| JPS62222906A | 1987-09-30 | |||
| JPS61196537A | 1986-08-30 | |||
| JPS61184841A | 1986-08-18 |
Attorney, Agent or Firm:
Hironobu Onda