To provide the manufacturing method of a wafer, that can easily align the OF part of a thin-plate semiconductor wafer and the display reference point of a photo mask, and can bake a highly accurate photoresist pattern.
One side of a slice thin-plate semiconductor crystal wafer which is cut by slicing a semiconductor crystal ingot is cleaved for providing an OF part, an outer periphery part other than the OF part of the slice thin-plate wafer is machined into a circle or the circle and a flat surface as nearly a circular, thin-plate semiconductor crystal wafer, a dummy chip is allowed to adhere to the OF part of the nearly circular, thin-plate semiconductor crystal wafer for applying onto a polishing plate, the nearly circular, thin-plate semiconductor crystal wafer is subjected to lap polishing and mirror polishing, and nearly the circular, thin-plate semiconductor crystal wafer obtained by mirror polishing is successively subjected to finish polishing, cleaning, and drying processes.
ONISHI MASAYA
INADA TOMOKI
