Title:
ウエハマウント方法とウエハマウント装置
Document Type and Number:
Japanese Patent JP5324319
Kind Code:
B2
Abstract:
A reinforcing support substrate is joined to a surface of the semiconductor wafer via a double-faced adhesive tape, and then is removed from the semiconductor wafer. Subsequently, the semiconductor wafer with the support substrate removed therefrom is adhesively held on a rear face of a ring frame via a support adhesive tape, and the double-faced adhesive tape is separated from the surface of the semiconductor wafer integrate with the ring frame.
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Inventors:
Masayuki Yamamoto
Yukitoshi Hase
Yukitoshi Hase
Application Number:
JP2009126650A
Publication Date:
October 23, 2013
Filing Date:
May 26, 2009
Export Citation:
Assignee:
NITTO DENKO CORPORATION
Nitto Seiki Co., Ltd.
Nitto Seiki Co., Ltd.
International Classes:
H01L21/683; H01L21/301; H01L21/677
Domestic Patent References:
| JP2004087660A | ||||
| JP2005116679A | ||||
| JP2006303012A | ||||
| JP2007043048A | ||||
| JP2003347060A |
Attorney, Agent or Firm:
Tsutomu Sugiya
Hiroyuki Todaka
Hiroyuki Todaka