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Patent Searching and Data


Title:
WAFER PACKAGING CONTAINER AND METHOD OF WAFER PACKAGING THEREWITH
Document Type and Number:
Japanese Patent JP2000049218
Kind Code:
A
Abstract:

To package wafers which have a plurality of sizes, with a single container.

A wafer packaging container 10 that packages a plurality of wafers 20 is provided with a cylindrical body 11, which has an opened upper edge and a closed lower edge, and which has an inner diameter larger than the largest outer diameter among the wafers 20 to be packaged, a cap 12 that covers freely at the upper edge of the body 11 to be capable of closing the opening, a stay 13 standing at the center of the bottom of the cylindrical body 11, cushions 14 made of an elastic material and each having a through-hole 15 for the stay 13 to pass through, and protecting sheets 16 each having a through-hole 17 for the stay 13 to pass through. As a result, by inserting the stay standing on the body into a hole opened on each wafer to be packaged, wafers of different sizes can all be packaged in a wafer packaging container of identical standard, and the running cost for the wafer packaging can be reduced by enhancing the interchargeability or general-purposeness of the wafer packaging container.


Inventors:
EMATA KOJI
SHIMOISHI TOMOAKI
TSUBOI KAZUYA
SASAKI MASAKO
NUMAZAKI MASAHITO
AZUMA SHUICHIRO
OKINAGA TAKAYUKI
ENOMOTO USUKE
Application Number:
JP22656298A
Publication Date:
February 18, 2000
Filing Date:
July 28, 1998
Export Citation:
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Assignee:
HITACHI LTD
HITACHI ULSI SYS CO LTD
International Classes:
B65D85/86; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65D85/86
Attorney, Agent or Firm:
Kajiwara Tatsuya