Title:
WAFER PEELING OFF METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP3524267
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To peel off a wafer without affecting the wafer with small force by rotating the wafer in the face direction, with the end point at the bonding section between the wafer and the fixing member as a fulcrum, and future, sifting the wafer in the face direction, and shifting the wafer out of the region of wafers in a row.
SOLUTION: The adhesive section between each wafer and a fixing member 1 is soaked in a sifting vessel 31 kept at about 90°C by a heater, and it is fixed with a cylinder 31b for fixing and a frame 31c for fixing. Next, a pressure member 35 out in advance in a retreat position 35B is shifted to a pressure position 35A, and one sheet of wager positioned at the end of the row of wafers is sucked with a wafer suction board 32. Then, the wafer is shifter in the face direction by a rotary actuator 33, with the end point of the bonding section between the wafer and a fixing member as a fulcrum. At this time, an air current is jetted from an air nozzle 37. Hereby, the wafer can be peeled off gradually from the side of the end point 30a at the bonding section of the wafer.
Inventors:
Kimura, Shigeru
Kumabe, Shigeo
Kumabe, Shigeo
Application Number:
JP14200096A
Publication Date:
May 10, 2004
Filing Date:
June 04, 1996
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
MITSUBISHI MATERIALS SHILICON CORP
MITSUBISHI MATERIALS SHILICON CORP
International Classes:
B65G59/00; H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
志賀 正武 （外２名）