Title:
破いて開けるウエハー収容コンパートメントを備えるウエハーポケット
Document Type and Number:
Japanese Patent JP2013529159
Kind Code:
A
Abstract:
In order to be able to remove a wafer 4 conveniently from a wafer pocket 1, it is proposed that the wafer pocket 1 be formed by a first enveloping film 9 and a second enveloping film 11, which are connected to one another via at least one connecting region 2, such that a wafer accommodating compartment 3 which is suitable for accommodating the wafer 4 and which is sealed off toward the outside is formed between the first enveloping film 9 and the second enveloping film 11, at least one of the enveloping films 9, 11 being weakened within a weakening region 5 located in the region of the wafer accommodating compartment 3, such that the wafer accommodating compartment 3 can be opened by tearing open the wafer pocket 1 along a tearing line that passes the weakening region 5. In order furthermore to ensure that the outer sides of the wafer pocket 1 are esthetically attractive and to meet the requirements made of necessary identification obligations, the weakening region 5 is spaced apart from each edge of the wafer pocket 1. Moreover, the tearing line additionally runs partly outside the weakening region.
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Inventors:
Katrin Reichart
Sufen filler
Kirsten Gorin
Sufen filler
Kirsten Gorin
Application Number:
JP2013506668A
Publication Date:
July 18, 2013
Filing Date:
April 28, 2011
Export Citation:
Assignee:
Bayer Intellectual Property GmbH
International Classes:
B65D33/00; A61J1/03; B65D65/26; B65D75/62
Attorney, Agent or Firm:
Hiroshi Yamazaki
Mitsuo Tanaka
Yasushi Ohata
Yukino Okunishi
Mitsuo Tanaka
Yasushi Ohata
Yukino Okunishi