To provide a wafer polishing device which prevents excessive polishing of the outer circumferential part of a wafer and uniformly polish the whole surface of the wafer.
A rubber ring 80 is provided for the outer circumference over the lower surface of a carrier 24 pressing a wafer 54 over to polishing cloth 16. The rubber ring 80 is made of material which is elastically deformed by eccentric loading when the aforesaid loading is transmitted to the outer circumferential part of the wafer 54 through the polishing cloth 16 by way of a pressure air layer. Therefore, the provision of the rubber ring 80 thereby allows eccentric loading to be absorbed while the aforesaid ring is being elastically deformed, thereby prevents the outer circumferential part from being excessively polished, and resultantly, allows the whole surface of the wafer to be uniformly polished.
SAKAI KENJI
SATO MANABU
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