Title:
WAFER POLISHING HEAD
Document Type and Number:
Japanese Patent JP3855555
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer polishing head allowing easy cleaning, and capable of improving machining accuracy of a wafer.
SOLUTION: This wafer polishing head 21 has a head body 12 comprising a top plate part 13 and a tube-like peripheral wall part 14, a diaphragm 15 of an elastic body stretched inside the head body 12, and a sub carrier 16 fixed on lower face of the diaphragm 15. A fluid supply mechanism 33 for supplying air and pure water W (a cleaning liquid) as fluid is connected to a fluid chamber 24 formed between the head body 12 and the diaphragm 15. The head body 12 is formed with a cleaning liquid line 23 connecting the fluid chamber 24 and a front end part of the head body 12. The cleaning liquid line 23 is provided with a valve V opened and closed by a controller 34.
Inventors:
Tatsunori Kobayashi
Naoki Rikida
Hiroshi Tanaka
Naoki Rikida
Hiroshi Tanaka
Application Number:
JP25142999A
Publication Date:
December 13, 2006
Filing Date:
September 06, 1999
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B24B37/005; B24B37/04; B24B37/30; B24B37/32; B24B55/06; H01L21/304; (IPC1-7): B24B37/04; B24B37/00; H01L21/304
Domestic Patent References:
| JP10193253A | ||||
| JP11176775A | ||||
| JP8300253A | ||||
| JP2000000754A | ||||
| JP8339979A | ||||
| JP5212620A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Yutaka Matsutomi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Yutaka Matsutomi
Kazuya Nishi
Yasuhiko Murayama