Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ウェハの研磨方法及びナノバブル循環型研磨装置
Document Type and Number:
Japanese Patent JP5703133
Kind Code:
B2
Inventors:
Shota Inato
Tokaibayashi Yoshihide
Application Number:
JP2011122920A
Publication Date:
April 15, 2015
Filing Date:
May 31, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Kyocera Crystal Device Co., Ltd.
International Classes:
B24B37/00; B24B37/08; B24B57/02
Domestic Patent References:
JP2009111095A
JP2000198062A
JP2011005584A
JP10330132A
JP2009141347A
JP2002016025A
JP2003136405A
JP2007331088A
JP246729A
JP3131025A
JP2000343390A
JP2008103701A
Foreign References:
US6354921



 
Previous Patent: 固体撮像装置

Next Patent: 車両用動力伝達装置