To secure proper surface finishing precision so as to improve quality by surely bringing the whole surface of a wafer into close adhesion with a wafer adhesion body.

A wafer 30 is placed on the surface of a wafer adhesion body 22 via a pressure adhesive agent 31 such as wax so as to be pressed onto the wafer adhesion body 22 side, so that the wafer 30 is pushing pressed against the wafer adhesion body 22. In this process, an approximately center part 30a, where the pressure adhesive agent 31 is positioned in the wafer 30 placed on the wafer adhesion body 22, is pressed partially at first, and then, other outer circumference part 30b is pushingly pressed.