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Title:
WAFER PROBER
Document Type and Number:
Japanese Patent JPH11108955
Kind Code:
A
Abstract:

To enhance the frequency characteristics of a signal by constituting a plurality of groups mutually connecting the outside conductor of the coaxial part of a coaxial type probe needle with a cable or a braided wire, and abutting the common ground signal of the coaxial type probe needle on a pad by a ground probe needle.

The outside conductor part 1a of a coaxial type probe needle making the probe needle of a signal line quickly transferring data and the outside conductor part 1b of the coaxial type probe needle making a probe needle for a signal ground signal coaxial are provided. A cable 4 shortly thickly connect the outermost edge parts of outside conductor parts 1a, 1b. The size of the illustrated loop is lessened. The edge part of the probe needle contacts on a pad 6, the pads 6a, 6b thereof are set for a signal, and the pad 6c is set for signal ground. The length of wiring for the processing of the signal ground of the outside conductor parts 1a, 1b of a coaxial cable is short, and noise margin can be improved.


Inventors:
MIZUTA MASAHARU
Application Number:
JP26536797A
Publication Date:
April 23, 1999
Filing Date:
September 30, 1997
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R1/073; H01L21/66; (IPC1-7): G01R1/073; H01L21/66
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)



 
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