Title:
WAFER PROBER
Document Type and Number:
Japanese Patent JPS5852839
Kind Code:
A
Abstract:
PURPOSE:To eliminate a probe scratch to be generated by a detecting probe, and to contrive to enhance the quality of a semiconductor pellet by a method wherein a measuring probe is used in combination as the detecting probe of a wafer existence detecting circuit. CONSTITUTION:Probes 2 of a large number a made to come in contact with electrodes 10 of the pellet 9 surrounded with th scribing area 8 of a wafer 1. The probes 2 thereof are made as to be fixed to the rear edge of probe cards 4. One of the probes 2 is used both as the detecting probe 12 to detect existence of the wafer 1, and the tip of a perceiving probe 13 is made to face on the middle thereof as to intersect therewith. When the wafer 1 rises to make the electrodes 10 to come in contact with the probes 2, the perceiving probe 13 and the detecting probe 12 are made to be in non-contact condition, and the measuring probes only are made to come in contact with bonding pads of the pellet in the wafer. The detecting probe and the perceiving probe are in open circuit condition electrically until the wafer comes in contact with the measuring probe, and both the probes thereof are in closed circuit condition electrically when the measuring probe to serve as well as the detecting probe comes in contact with the wafer.
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Inventors:
KUWAKINO MOTOI
Application Number:
JP15060681A
Publication Date:
March 29, 1983
Filing Date:
September 25, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G01R1/073; H01L21/66; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Toshiyuki Usuda