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Title:
WAFER PROCESSING APPARATUS WITH WAFER MAPPING FUNCTION
Document Type and Number:
Japanese Patent JP3916148
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To solve a problem in which trouble occurs in each processing stage when a plurality of wafers are mounted on each stage of a shelf in a pod and a problem in which a wafer can accurately be detected because of the increase of errors when the detection is carried out by moving a sensor by a driving means with an unstable speed, such as an air cylinder, when the sensor is moved by using such a driving means for simpler constitution of a device detecting the wafer.
SOLUTION: The wafer processing apparatus is equipped with a transmission sensor 9 for wafer detection, a dock with an index means, and a transmission sensor for the dock. The wafer processing apparatus calculates the rate of the continuation of the signal from the wafer detecting transmission type sensor 9 and the continuation of the signal from the transmission type sensor for the dock corresponding to the index means and compares the ratio with a previously set value to judge the number of wafers 1.


Inventors:
Atsushi Emoto
Takeshi Kagaya
Kazuo Yamazaki
Application Number:
JP2002331868A
Publication Date:
May 16, 2007
Filing Date:
November 15, 2002
Export Citation:
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Assignee:
tdk Corporation
International Classes:
H01L21/67; H01L21/00; H01L21/68; (IPC1-7): H01L21/68
Domestic Patent References:
JP11145250A
JP8213447A
JP4345049A
JP1315156A
JP2000150624A
JP2002184839A
JP9136723A
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa