Title:
WAFER PROCESSING APPARATUS WITH WAFER MAPPING FUNCTION
Document Type and Number:
Japanese Patent JP3916148
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve a problem in which trouble occurs in each processing stage when a plurality of wafers are mounted on each stage of a shelf in a pod and a problem in which a wafer can accurately be detected because of the increase of errors when the detection is carried out by moving a sensor by a driving means with an unstable speed, such as an air cylinder, when the sensor is moved by using such a driving means for simpler constitution of a device detecting the wafer.
SOLUTION: The wafer processing apparatus is equipped with a transmission sensor 9 for wafer detection, a dock with an index means, and a transmission sensor for the dock. The wafer processing apparatus calculates the rate of the continuation of the signal from the wafer detecting transmission type sensor 9 and the continuation of the signal from the transmission type sensor for the dock corresponding to the index means and compares the ratio with a previously set value to judge the number of wafers 1.
Inventors:
Atsushi Emoto
Takeshi Kagaya
Kazuo Yamazaki
Takeshi Kagaya
Kazuo Yamazaki
Application Number:
JP2002331868A
Publication Date:
May 16, 2007
Filing Date:
November 15, 2002
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L21/67; H01L21/00; H01L21/68; (IPC1-7): H01L21/68
Domestic Patent References:
JP11145250A | ||||
JP8213447A | ||||
JP4345049A | ||||
JP1315156A | ||||
JP2000150624A | ||||
JP2002184839A | ||||
JP9136723A |
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa