To provide a wafer processing apparatus reducing a working labor involved in reducing the number of components and suppressing increase of a cost, by providing a vacuum chuck suction mechanism compatible with dicing frames of a plurality of sizes.

A plurality of frame holding parts 30 are disposed around a vacuum chuck type chuck table 21 on which a wafer 1 is placed. The frame holding part 30 includes: a movable piece 32 having a suction pad 33 for sucking and holding a dicing frame 6; and a guide rod 31 for movably supporting the movable piece 32 along a radial direction of the chuck table 21. The movable piece 32 is moved according to a diameter of the held dicing frame 6, and locked by a lock mechanism, and the dicing frame 6 is sucked and held in this position.