Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2016157892
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer processing method which can effectively remove burrs formed on both sides of a laser processes groove formed by ablation processing.SOLUTION: A processing method of a wafer 2 in which a device is formed in a functional layer 21 laminated on a surface of a substrate 20 comprises the steps of: irradiating the wafer with laser beams of a wavelength having absorptivity to the wafer to perform ablation processing to remove the functional layer; and cutting the substrate by a cutting blade 523 along a region where the functional layer is removed to divide the wafer into individual devices. By jetting a pressurized fluid from a nozzle 541 arranged forward or backward of the cutting blade in a cutting feed direction, burrs 25 standing on both sides of a laser processed groove, which are formed in the ablation processing step are removed.SELECTED DRAWING: Figure 8
Inventors:
HOSHINO HITOSHI
ZANIMIR ANGUELOV
ZANIMIR ANGUELOV
Application Number:
JP2015036348A
Publication Date:
September 01, 2016
Filing Date:
February 26, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/00; B23K26/36; B24B27/06; B24B55/06
Domestic Patent References:
| JP2006140311A | 2006-06-01 | |||
| JP2004303855A | 2004-10-28 | |||
| JP2006187834A | 2006-07-20 | |||
| JP2013144324A | 2013-07-25 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sayaka Hirakawa
Toshiyuki Kojima
Sachiko Okunuki
Sayaka Hirakawa
Toshiyuki Kojima
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