Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2021185591
Kind Code:
A
Abstract:
To provide a wafer processing method in which a part of an adhesive layer adheres to the surface of a device and the quality of the device is not deteriorated even when a protective tape is peeled off from the surface of a wafer.SOLUTION: A wafer processing method includes a thermocompression bonding sheet arranging step of arranging a thermocompression bonding sheet 20 on the surface 10a of a wafer 10, a cutting equipment preparation step of preparing a cutting device equipped with at least a chuck table, cutting means equipped with a rotatably cutting blade that cuts while supplying cutting water to the wafer, and feeding means for processing and feeding, a cutting step of cutting a wafer split line 14 with a cutting blade and performing splitting into individual device chips, and a peeling step of peeling the thermocompression bonding sheet from the surface of the device chip.SELECTED DRAWING: Figure 1
Inventors:
OMAE MAKIKO
Application Number:
JP2020090229A
Publication Date:
December 09, 2021
Filing Date:
May 25, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko