Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022174548
Kind Code:
A
Abstract:
To propose a new technique that reliably prevents a broken part from adhering onto a device when a protruding portion of a die attach layer is broken.SOLUTION: A wafer processing method includes a bonding step of forming a die attach layer 20 in which a protruding portion 22 is formed on the outer periphery of a wafer 10 by attaching the wafer 10 to a sheet S via the die attach layer 20 having a diameter larger than the diameter of the wafer 10, and a protruding portion removing step of removing the protruding portion 22 from the sheet S by bringing a removing member 33 into contact with the protruding portion 22.SELECTED DRAWING: Figure 3
Inventors:
CHO KINEN
HARADA SHIGENORI
HARADA SHIGENORI
Application Number:
JP2021080423A
Publication Date:
November 24, 2022
Filing Date:
May 11, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; H01L21/683
Attorney, Agent or Firm:
Hiroshi Ogami
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