Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022178899
Kind Code:
A
Abstract:
To provide a wafer processing method capable of suppressing cracking of an edge-trimmed wafer when grinding the wafer and generation of dust in the step after the grinding.SOLUTION: Prior to a grinding step of grinding a wafer, energy is supplied locally to a cutting surface of an outer peripheral region of a wafer formed in a trimming step. Accordingly, at least a portion of a damaged layer formed in the outer peripheral region of the wafer by the trimming step can be removed or repaired. As a result, it is possible to suppress the cracking of the wafer originating from the outer peripheral region when grinding the edge-trimmed wafer and the generation of dust in the post-grinding step.SELECTED DRAWING: Figure 4
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Inventors:
KIM YONG SUK
Application Number:
JP2021086011A
Publication Date:
December 02, 2022
Filing Date:
May 21, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B1/00; B24B7/04
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
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