Title:
WAFER PROCESSING METHOD AND WAFER
Document Type and Number:
Japanese Patent JP2023091816
Kind Code:
A
Abstract:
To provide a wafer processing method which can prevent a device from being damaged due to an etching liquid to be used when applying wet etching to a rear surface side of a device wafer included in a bonded wafer.SOLUTION: Provided is a wafer in which an inclined plane is formed in an outer peripheral region. Further, when liquid (for example, an etching liquid to be used for wet etching) is supplied to the outer peripheral region, the liquid flows on the inclined plane to easily flow to the outside of the wafer. Therefore, in a bonded wafer in which the wafer has been applied as a support wafer, a device is prevented from being damaged due to an etching liquid to be used when applying wet etching to a rear surface side of a device wafer.SELECTED DRAWING: Figure 3
Inventors:
MINATO KOKICHI
PAUL VINCENT ATENDIDO
PAUL VINCENT ATENDIDO
Application Number:
JP2021206615A
Publication Date:
July 03, 2023
Filing Date:
December 21, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; H01L21/304
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato