Title:
ウエハ加工用テープおよびそれを用いた半導体装置製造方法
Document Type and Number:
Japanese Patent JP4809595
Kind Code:
B2
Abstract:
To provide a tape for processing a wafer which suppresses chipping when the wafer is laminated and diced.
The tape for processing the wafer includes an intermediate resin layer and an adhesive layer sequentially laminated on a substrate film. The peak (glass transition point) of tan δ obtained by the dynamic viscoelasticity measurement of the intermediate resin layer coated and formed on the substrate film is -20°C or higher which is higher than the glass transition point of the adhesive layer.
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Yabuki Akira
Shozo Yano
Kenji Kita
Shozo Yano
Kenji Kita
Application Number:
JP2004227023A
Publication Date:
November 09, 2011
Filing Date:
August 03, 2004
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/02; C09J133/00
Domestic Patent References:
| JP2002235055A | ||||
| JP7029860A | ||||
| JP2000281992A | ||||
| JP5082639A | ||||
| JP2000124169A | ||||
| JP4309583A | ||||
| JP2002105134A |
Attorney, Agent or Firm:
Seiichi Inoue