Title:
WAFER PROXIMITY SENSOR
Document Type and Number:
Japanese Patent JPH06120327
Kind Code:
A
Abstract:
PURPOSE: To sense a proper position of a semiconductor wafer by making the distance between the semiconductor wafer and a heating/cooling plate determine the flow of air or gas passing through a flowmeter. CONSTITUTION: This sensor is equipped with a heating/cooling plate (plate) 12, having an opening part, a stepping device for moving a semiconductor wafer 11, and a vacuum source and the flowmeter 27 connected to the opening part of the plate 12. A vacuum is applied to the opening part of the plate 12, and air flows through between the semiconductor wafer and plate 12 and through the flowmeter 27. Then this device indicates the rate of the air flowing through the flowmeter 27 and the air flowing through between the semiconductor wafer 11 and the plate 12, by the distance between the semiconductor wafer 11 and the surface of the plate 12. Further, the flow of the air flowing through the flowmeter 27 determines the motion of the stepping device, which moves the semiconductor wafer 11 in response to the plate 12.
Inventors:
JIYOU DABURIYU EIYAAZU
Application Number:
JP13920692A
Publication Date:
April 28, 1994
Filing Date:
May 29, 1992
Export Citation:
Assignee:
TEXAS INSTRUMENTS INC
International Classes:
H01L21/324; G01B13/12; H01L21/683; (IPC1-7): H01L21/68; H01L21/324
Attorney, Agent or Firm:
Akira Asamura (3 outside)