To provide a method in which an adhesive having been patterned is prevented from flowing out to stick on an image sensor surface, filling with the adhesive is carried out almost to the image sensor surface, and light shielding properties are given when a wafer for CMOS image sensor and a glass wafer are stuck together in a chip size package manufacturing process.

Grooving is carried out in a lattice pattern shape along dicing lines on a sealing glass wafer surface to be stuck on a wafer having multiple units of CMOS image sensors formed, adhesive paste is screen-printed or applied by a dispenser in a pattern shape including the interior of a straight line connecting points at the same distance from a lattice intersection or the interior of a curved line at the same distance at the lattice pattern and an intersection part of the lattice pattern, and the wafer having the multiple units of CMOS image sensors and the glass wafer are stuck together.