Title:
Wafer sticking method
Document Type and Number:
Japanese Patent JP6164822
Kind Code:
B2
Abstract:
A wafer attaching method of attaching a wafer having a warp to a sheet includes a wafer warp detecting step of detecting a surface shape of the wafer, a wafer positioning step of applying a photocuring liquid resin to the sheet and positioning the wafer so that a predetermined surface of the wafer corresponding to attaching conditions preset in a resin bonding apparatus is opposed to the sheet and the liquid resin according to the preset attaching conditions and the surface shape detected above, and a wafer attaching step of pressing the wafer against the liquid resin to thereby spread the liquid resin over the entire area where the wafer and the sheet are superimposed, next removing the pressure applied to the wafer, and next applying light to the liquid resin to cure the liquid resin, thereby attaching the predetermined surface of the wafer to the sheet.
Inventors:
Kazuma Sekiya
Hiroshi Onodera
Hiroshi Onodera
Application Number:
JP2012251445A
Publication Date:
July 19, 2017
Filing Date:
November 15, 2012
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; H01L21/683
Domestic Patent References:
| JP2004087523A | ||||
| JP2003260644A | ||||
| JP2010155298A | ||||
| JP2012143723A |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Yoshimasa Okada
Toru Kanno
Tsutomu Mizoguchi
Amada Masayuki
Yoshimasa Okada
Toru Kanno
Tsutomu Mizoguchi
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