Title:
WAFER TRANSFER EQUIPMENT
Document Type and Number:
Japanese Patent JP3157648
Kind Code:
B2
Abstract:
PURPOSE: To load a wafer on the recessed part of a SiC tray with certainty by detecting the position of the SiC tray 5 in a wafer transfer equipment of a normal pressure vapor phase growth apparatus.
CONSTITUTION: A sensor hole 4 of a slit shape perpendicular to the feed direction on the center line of a recessed part 11 of a SiC tray 5 is made and a sensor 1 to detect this sensor hole 4 is provided. When a sensor 2 and the sensor 1 detect a slit of an encoder 3 and the sensor hole 4, a chuck opening/closing controller 10 is activated to open a chuck 8 and drop a wafer 7 into the recessed part 11.
Inventors:
Hiroyuki Murakami
Application Number:
JP10785993A
Publication Date:
April 16, 2001
Filing Date:
May 10, 1993
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
B65G47/86; B65G49/07; H01L21/205; H01L21/677; H01L21/68; (IPC1-7): H01L21/205; B65G47/86; B65G49/07; H01L21/68
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)