Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WARPING SUPPRESSION DEVICE AND MANUFACTURING METHOD FOR METAL PLATE USING THE WARPING SUPPRESSION DEVICE
Document Type and Number:
Japanese Patent JP2010247292
Kind Code:
A
Abstract:

To provide a warping suppression device capable of enhancing productivity of a metal plate and a manufacturing method for a metal plate capable of enhancing productivity.

The warping suppression device 1 has a pressing part 1a for pressing an ear part 30 of a side surface of the metal plate cut by a side surface cutting machine 10 in a shearing line 100 of the metal plate at a downstream side in a metal plate conveying direction than the side surface cutting machine; and a support part 1b for supporting the pressing part. The manufacturing method for the metal plate has a step for cutting the metal plate by the side surface cutting machine of the shearing line. In the manufacturing method for the metal plate, the ear part 30 of the side surface of the metal plate cut by the side surface cutting machine 10 is pressed by the warping suppression device 1 arranged above the metal plate conveyed on the shearing line, and after a distal end 30a of the ear part firstly cut by the side surface cutting machine 10 is passed just below the warning suppression device, the pressing part 1a is brought into contact with the ear part 30.


Inventors:
HARA SOSUKE
TSUDA TAKASHI
ISHIDA TAKEHIKO
OKADA HIROSHI
NOGUCHI MASAO
Application Number:
JP2009100635A
Publication Date:
November 04, 2010
Filing Date:
April 17, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO METAL IND
International Classes:
B23D33/00; B21B15/00; B23D19/06
Domestic Patent References:
JPH06170635A1994-06-21
JPH0890330A1996-04-09
JPH09262716A1997-10-07
JP2007268619A2007-10-18
JP2003145340A2003-05-20
Attorney, Agent or Firm:
Tetsuro Hoshino
Akihiko Yamashita
Kishimoto Tatsuto



 
Previous Patent: FLAT PLATE PUNCHING DEVICE

Next Patent: HANDLE OF TOOL