Title:
WATER-BASE ADHESIVE
Document Type and Number:
Japanese Patent JP3522729
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a water-base adhesive which is contained in a container with a nozzle, comprises a vinyl acetate resin emulsion obtained by seed polymerization, can be readily extruded through the tip of the nozzle, is excellent in shape retentivity, and scarcely causes sagging even when applied on a vertical surface at a relatively high temperature.
SOLUTION: The water-base adhesive contained in a container with a nozzle is obtained by filling a water-base adhesive comprising a vinyl acetate resin emulsion made by seed polymerization into a container with a nozzle. The adhesive has a storage modulus G' (at 23°C) of 120 Pa or higher and a shear stress τ (at 7°C) of 2,000 Pa or lower. The vinyl acetate resin emulsion may be an emulsion obtained by subjecting vinyl acetate to seed polymerization in an ethylene/vinyl acetate copolymer resin emulsion.
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Inventors:
Origuchi, Toshiki
Application Number:
JP2002026394A
Publication Date:
April 26, 2004
Filing Date:
February 04, 2002
Export Citation:
Assignee:
KONISHI CO LTD
International Classes:
C09J131/04; C09J129/10; C09J131/02; C09J133/04; C09J151/06; (IPC1-7): C09J131/04; C09J129/10; C09J131/02; C09J133/04; C09J151/06
Other References:
高分子学会高分子辞典編集委員会編，新版高分子辞典，株式会社朝倉書店，１９８８年１１月２５日，３９０
Attorney, Agent or Firm:
後藤 幸久