Title:
WATER-BORNE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2004091559
Kind Code:
A
Abstract:
To provide a water-borne resin composition which has adhesiveness capable of responding to low temperature baking treatments and has excellent stain resistance, water resistance, and the like.
This water-borne resin composition is characterized by being obtained by emulsion-polymerizing a polymerizable unsaturated monomer on a water-borne resin composition of a carboxy group-containing chlorinated polypropylene-based random copolymer obtained by modifying a polypropylene-based random copolymer produced in the presence of a metallocene catalyst with an α,β-unsaturated carboxylic acid or its anhydride and chlorine.
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Inventors:
NISHIJIMA EIJI
YOSHIOKA HIDETOSHI
TAKAMOTO NAOSUKE
FUJINO KENICHI
YOSHIOKA HIDETOSHI
TAKAMOTO NAOSUKE
FUJINO KENICHI
Application Number:
JP2002252385A
Publication Date:
March 25, 2004
Filing Date:
August 30, 2002
Export Citation:
Assignee:
JUJO PAPER CO LTD
International Classes:
C08F2/22; C08F255/00; (IPC1-7): C08F255/00; C08F2/22
Attorney, Agent or Firm:
Kiyoshi Minoura
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