To provide a treatment agent which suppresses the oxidation of a terminal part of an electronic component during storage of the component, or removes an already formed oxide film, and imparts excellent solder wettability to the terminal part when soldering is performed using lead-free solder on packaging, and to provide a treatment method using the same.
The water soluble treatment agent for improving solder wettability comprises: (A) an organic acid amine salt; (B) at least one kind selected from monohydric alcohols, glycols and polar nonprotic solvents; and (C) a nonionic surfactant. Using the same, the oxidation of an electronic component terminal is prevented, or an already formed oxide film is removed, and the solder wettability of the terminal is increased, and solder joining is securely and firmly performed.
ARIMATSU KAZUHIKO
ITO HIROSHI
YAMADA KOJI
KIRESUTO KK
Kyuichi Ueki