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Title:
WATERPROOF HEAT-INSULATION STRUCTURE AND HEAT-INSULATION SUBSTRATE FOR USE THEREIN
Document Type and Number:
Japanese Patent JP2007277936
Kind Code:
A
Abstract:

To provide a heat-insulation waterproof technique applicable to a heat-insulation waterproof structure implemented by stretching waterproof sheets on panels sandwiching a heat-insulation material, wherein the technique achieves good workability, uniform structural quality, and low construction costs.

The heat-insulation waterproof structure is formed of a heat-insulation substrate rigidly laid on a construction surface such as a roof and a roof floor, and a waterproof layer stretched on an upper surface of the heat-insulation substrate. The heat-insulation substrate is formed of a heat-insulation core layer, metallic layers connected to both upper and lower surfaces of the heat-insulation core layer, and intermediate layers formed on surfaces of the respective metallic layers. Then the waterproof layer and the heat-insulation substrate are fixed via the intermediate layers by fixing means.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
TAJIMA KUNIO
KOJIMA TORU
FUKUDA SUGIO
KAMEI MASAHIRO
Application Number:
JP2006105840A
Publication Date:
October 25, 2007
Filing Date:
April 07, 2006
Export Citation:
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Assignee:
TAJIMA ROOFING CO
International Classes:
E04D12/00; E04B1/80; E04D5/00
Domestic Patent References:
JP2002061339A2002-02-28
JP2005146774A2005-06-09
JPH0988178A1997-03-31
JPH04368552A1992-12-21
JP2005264481A2005-09-29
JP2005314903A2005-11-10
JP2005171623A2005-06-30
JPH03108969A1991-05-09
Attorney, Agent or Firm:
Koichi Ouchi



 
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