To provide a waterproof heat-insulation structure at a low cost, which prevents damage of heat insulation materials due to walking of the operator thereon during construction, inspection, etc. wherein the waterproof heat-insulation structure prevents damage of the heat insulation materials by heat at the time of electromagnetic induction heating, when waterproof sheets are fixed by the electromagnetic induction heating.
The waterproof heat-insulation structure is constructed by successively laying and fixing the heat insulation material, a reinforcing layer having a withstanding compressive strength of 0.1 N/mm2 or more and a void of 1 to 95%, and a waterproof sheet, onto a skeleton. Preferably the waterproof heat-insulation structure is constructed by successively laying the heat insulation material and the reinforcing layer on the skeleton, arranging a fixing disk plate having a heat sealing layer on an upper surface thereof, at a necessary location of the reinforcing layer, penetrating a screw or the like into the heat insulation material and the reinforcing layer to fix the fixing disk plate onto the skeleton, thereafter laying the waterproof sheet on the reinforcing layer fixed by the fixing disk plate, and heating the fixing disk plate by the electromagnetic induction heating, to thereby weld and fix the waterproof sheet to the fixing disk plate.
SASAKI WATARU
WAKI TATSUO
| JPS63190423U | 1988-12-07 | |||
| JPS63190423U | 1988-12-07 | |||
| JP2005146775A | 2005-06-09 | |||
| JP2002294940A | 2002-10-09 | |||
| JP2006022609A | 2006-01-26 | |||
| JPS55132846A | 1980-10-16 |
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