Title:
WAVEGUIDE INTERCONNECT
Document Type and Number:
Japanese Patent JP2020022156
Kind Code:
A
Abstract:
To provide a waveguide interconnect for joining a chip to another component and a method of forming the same.SOLUTION: A waveguide interconnect 100 is formed with a dielectric layer 30. The waveguide interconnect 100 includes at least a pair of elongated through holes 43 having longitudinal axes parallel to each other. Thereby, an elongated stripe 44 of the dielectric layer 30 extending in a direction of a vertical axis is formed. The dielectric layer 30 between the elongated through holes 43 forms the waveguide 44.SELECTED DRAWING: Figure 1A
Inventors:
ILJA OCKET
Application Number:
JP2019105531A
Publication Date:
February 06, 2020
Filing Date:
June 05, 2019
Export Citation:
Assignee:
IMEC VZW
International Classes:
H01P3/16; H01P5/08; H01P11/00
Attorney, Agent or Firm:
Takuji Yamada
Hiroshi Okabe
Hiroshi Okabe