Title:
溶着フィルム及び接合体
Document Type and Number:
Japanese Patent JP7414160
Kind Code:
B2
Abstract:
A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.
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Inventors:
Ryota Shinbayashi
Nobuyuki Takahashi
Hayato Saito
Kazuhiro Kuroki
Nobuyuki Takahashi
Hayato Saito
Kazuhiro Kuroki
Application Number:
JP2022580602A
Publication Date:
January 16, 2024
Filing Date:
February 04, 2022
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J7/10; B32B27/00; C09J7/35; C09J171/10
Foreign References:
| WO2022209116A1 | ||||
| WO2022014503A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office
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