Title:
リフトストラップ付き溶接ワイヤパッケージ
Document Type and Number:
Japanese Patent JP4197326
Kind Code:
B2
Abstract:
A package (10;200) for containing a coil (30) of wire having an outer cylindrical surface extending about a coil axis, a top (40) and an oppositely facing bottom (48) has a base (12;212) for supporting the bottom of a wire coil when the wire coil is in the package. At least one side wall extends upwardly from the base about an outer cylindrical surface of the wire coil and has an upper edge (14;240;242) defining a top opening in the package for removing the wire. The packaging further includes a hold-down bar (50) between the bottom of the wire coil and the base which is transverse to the axis of the wire coil, and a lifting strap (70) having a first end (72,120), a second end (74,122) and a base portion (80) between the first and second ends and between the bottom of the wire and the base. The base portion has an opening (82) and the hold-down bar extends through the opening.
Inventors:
David Jay Burton
Application Number:
JP2005198290A
Publication Date:
December 17, 2008
Filing Date:
July 07, 2005
Export Citation:
Assignee:
Lincoln Global Incorporated
International Classes:
B65D85/04; B23K9/133; B65D25/22; B65D88/54; B65D90/00; B65H49/08; B65H49/38; B66C1/18; B23K; B65D
Domestic Patent References:
| JP50002065U | ||||
| JP2003145268A | ||||
| JP2003312763A |
Foreign References:
| DE202004000906U1 | ||||
| US5105943 | ||||
| US3933287 |
Attorney, Agent or Firm:
Takehiko Saito
Yasuyuki Hata
Yasuyuki Hata