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Title:
WELDING EQUIPMENT FOR THIN FILM, METHOD FOR WELDING THIN FILM, BELT FORMED OF WELDED THIN FILM, AND IMAGE FORMING DEVICE USING THE BELT FORMED OF WELDED THIN FILM
Document Type and Number:
Japanese Patent JP2001347384
Kind Code:
A
Abstract:

To provide an endless belt of a thin film whose thickness is 50 μm or smaller produced with laser beam welding.

The thin film welding equipment is provided with thin film clamping devices (5+8+7; 5+8+27+28+29) furnished with thin film holding members (5+8), having a backup plate 5 and a laser beam transmitting plate 8 which holds both side faces of the lapped part or the butted part of two thin films S whose thickness is 50 μm or smaller, and pressure welding equipment (7; 27+28+29) which pressure-welds the backup plate 5 and the laser beam transmitting plate 8, and further provided with a laser beam irradiating devices (17+21+23) having an optical system with which devices a line to be welded which is the pat to be welded of the lapped part of the two thin films S or the butted part is irradiated with the laser beam, and with which devices the part irradiated with the laser beam is welded.


Inventors:
YAMAZAKI SHINJI
OIKAWA HIROSHI
Application Number:
JP2000169581A
Publication Date:
December 18, 2001
Filing Date:
June 06, 2000
Export Citation:
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Assignee:
FUJI XEROX CO LTD
International Classes:
B23K26/00; B23K26/21; B23K101/16; (IPC1-7): B23K26/00
Attorney, Agent or Firm:
Takahide Tanaka