To provide batch-type wet-cleaning and wet-etching tanks, in which it is prevented that deterioration of cleaning performance and a decrease in an etching rate partially occur by adhesion of bubbles into a gap between a wafer and a wafer carrier or an uneven liquid convection only around a groove of the wafer carrier in the batch-type wet-cleaning and wet-etching of the semiconductor wafer.

In a treatment tank for a semiconductor wafer, between the semiconductor wafer and a wafer carrier for holding the wafer, only the wafer is rotated at a constant speed or a constant angle without moving the carrier, thereby bubbles adhered in a gap between the wafer and the carrier are removed or the wafer is positioned evenly in a groove of the carrier rather than only at a particular point, and thereby it is prevented that deterioration of cleaning power and the decrease in the etching rate partially occur, resulting in improvement of uniformity.