PURPOSE: To uniformalize the thickness of plating coating by providing anodes at both terminal sides of a band material in a plating tub, providing a shielding plate between the anode and the band material perpendicularly to the plane of the band material, and reducing the variance of current distribution between the terminal part and center part of the band material.

CONSTITUTION: Plating is performed on the band material 7 by applying the current between the band material 7 and the anodes 6 in plating solution in a plating tub. The shielding plate 8 is provided between the band material 7 and the anodes 6 provided at both terminal sides of the band material perpendicularly to the plane of the band material 7 in this wholly plating device. The plating is performed on the band material 7 by applying the current between the anodes 6 and the band material 7. In such a way, the variance of the current distribution 10 between the terminal part and the center part of the band material 7 can be reduced, and the thickness of the plating coating is made uniform.