Title:
ウイングボデーのリア構造
Document Type and Number:
Japanese Patent JP7341605
Kind Code:
B2
Abstract:
To provide a rear structure of a wing body which is superior in productivity and in which air resistance further can be reduced.SOLUTION: A rear structure of a wing body 3 according to the present invention comprises a rear opening part 9, where the rear opening part 9 comprises a pair of rear posts 10 and 10 constituting both side parts of the rear opening part 9 and a rear upper 11 connecting upper end parts of the pair of rear posts 10 and 10. At least either of outer side surfaces 102d of the pair of rear posts 10 and 10 and an upper surface 114c of the rear upper 11 is formed into an inclined surface inclined toward a center part P of the rear opening part 9, and front surfaces 102c and 114b continuously formed through a corner part in front of the inclined surface are inclined rearward.SELECTED DRAWING: Figure 3
Inventors:
Yuichi Iwahashi
Kazuo Kawai
Yasuo Moriwaki
Kazuo Kawai
Yasuo Moriwaki
Application Number:
JP2019127835A
Publication Date:
September 11, 2023
Filing Date:
July 09, 2019
Export Citation:
Assignee:
Nihon Full Half Co., Ltd.
International Classes:
B60J7/08; B62D35/00; B62D33/04; B62D37/02
Domestic Patent References:
JP9058529A | ||||
JP2012101715A | ||||
JP10016825A | ||||
JP2017119491A | ||||
JP2017105358A | ||||
JP2010115937A |
Foreign References:
US8985667 |
Attorney, Agent or Firm:
Atago Patent Attorneys Office
Naozumi Ono
Takashi Iida
Sachiko Okunuki
Tsuyoshi Tsukano
Toshiyuki Kojima
Naozumi Ono
Takashi Iida
Sachiko Okunuki
Tsuyoshi Tsukano
Toshiyuki Kojima
Previous Patent: Louvers for electrical equipment storage cabinets
Next Patent: Wafer processing method
Next Patent: Wafer processing method