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Title:
WIRE BONDING APPARATUS
Document Type and Number:
Japanese Patent JPH03150852
Kind Code:
A
Abstract:

PURPOSE: To enable always performing bonding well by blowing air against the section, introduced to a tension applying means, of a bonding wire to slack the wire upward and making non-contact detection of the slack of the wire with a sensor.

CONSTITUTION: A wire 34 is let out downward by rotating a wire spool 33, slacked upward with an air blower 43, straightened, introduced into a tension giving means 35, given upward tension, and introduced into a bonding tool 37 after it is straightened vertically. When the degree of the slack of the wire 34 decreases to the specified extent, a noncontact slack sensor 38 transmits an output signal to a controller 42 and complements by air blown downward from a main body 39 the slack by the dead weight of the wire 34 let out from the wire spool 33. Thereby the tension can stably be maintained without bending the wire 34 unnecessarily and good bonding can always be performed.


Inventors:
ARAI HIDEKI
SUEMATSU MUTSUMI
OTANI KAZUMI
Application Number:
JP28884989A
Publication Date:
June 27, 1991
Filing Date:
November 08, 1989
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)



 
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