Title:
WIRE BONDING DEVICE
Document Type and Number:
Japanese Patent JPS58130541
Kind Code:
A
Abstract:
PURPOSE:To control a loop height by a resultant spring force and prevent contacts with another, by providing two solenoids wherein springs and the springs with further stronger repulsive forces are provided in the upper clamp and then taking off the both solenoids during the descent of a junction tool. CONSTITUTION:When the solenoid 32 is taken off, a shaft 32a moves to right by the stability of the spring 32d, then a plate 32e presses the spring 33g to right, and a flat spring 33h and a member 33i presses a wire 23 to a member 33j resulting in clamp. When the solenoid 33 is taken off, a shaft 33a moves to right by the stability of a spring 33d, and the member 33i presses the wire 23 to the member 33j resulting in clamp. After joining the wire 23 to a pellet, the tool 35 is allowed to ascend with the clamp 29 open, and is clamped 29 at the upper dead point by removing slack by a guide, and moves to the descent. Then, the pellet moves, and the tool opposes to a lead frame. When the both solenoids are taken off in the halfway of the descent, the wire 23 is firmly clamped 29 by the resultant force of springs 33d and 32d, and does not project from the tool 35 too long as deemed unnecessary. Therefore, a loop height can be controlled, and accordingly contacts with another one can be prevented.
Inventors:
CHIBA KOUICHI
YAMAGUCHI MASAYOSHI
ATSUMI KOUICHIROU
KASHIMA NORIYASU
TSURUTA TOSHIROU
SUZUKI NOBUSHI
NAGASHIMA SUMIO
YAMAGUCHI MASAYOSHI
ATSUMI KOUICHIROU
KASHIMA NORIYASU
TSURUTA TOSHIROU
SUZUKI NOBUSHI
NAGASHIMA SUMIO
Application Number:
JP1277682A
Publication Date:
August 04, 1983
Filing Date:
January 29, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B23K3/00; H01L21/60; (IPC1-7): B23K1/00
Attorney, Agent or Firm:
Takehiko Suzue