Title:
WIRE BONDING METHOD
Document Type and Number:
Japanese Patent JP2017098281
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress a connection failure caused by a floating of a lead terminal.SOLUTION: A method for performing a wire boning an element 11 and a lead terminal 12, comprises: a step of bonding to the element 11 by a bonding head 22 provided in a bonding device 14 having the bonding head 22 of which a side surface provides a sim plate 23 while projecting; a step of inserting the sim plate 23 between a clamper 13 clamping the lead terminal 12 and the lead terminal 12; a step of fixing the lead terminal 12 by clamping the lead terminal 12 through the sim plate 23 by the clamper 13; and a step of bonding to the lead terminal 12, fixed by the clamper 13, by the bonding head 22.SELECTED DRAWING: Figure 1
Inventors:
SATO HIROSHI
Application Number:
JP2015225437A
Publication Date:
June 01, 2017
Filing Date:
November 18, 2015
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L21/60
Attorney, Agent or Firm:
Ken Ieiri