Title:
WIRE CONNECTION DEVICE
Document Type and Number:
Japanese Patent JP2022126384
Kind Code:
A
Abstract:
To provide a wire connection device capable of reducing the external influence on an electric wire as compared with a conventional technology.SOLUTION: A wire connection device 10 according to the present invention includes a DIN rail 20 that supports at least one electronic device 30 and has a groove 24 that is open on the side where the electronic device 30 is supported and extends in a longitudinal direction 2, and at least one wire 41, 42 housed in the groove 24. The wires 41 and 42 are electrically connected to connectors 32A and 32B provided in the electronic device 30, and exposed to a groove 24 while the electronic device 30 is supported by the DIN rail 20.SELECTED DRAWING: Figure 2
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Inventors:
WATANABE TOMONORI
NAGANO MASAAKI
YANO KOHEI
KUBO MASAHIKO
SUMI KOSUKE
YOSHIMARU KOSUKE
NAGANO MASAAKI
YANO KOHEI
KUBO MASAHIKO
SUMI KOSUKE
YOSHIMARU KOSUKE
Application Number:
JP2021024418A
Publication Date:
August 30, 2022
Filing Date:
February 18, 2021
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01R25/14; H01R41/00
Attorney, Agent or Firm:
Takuji Yamada
Hidehiro Tokuyama
Mitsuo Wada
Hidehiro Tokuyama
Mitsuo Wada
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