To solve a problem that defective delivery of a very fine wire solder frequently occurs if it is used for a known technology, and more specifically, the wire solder is hooked by a part in a vicinity of an inlet or an inner surface of a holding member when a chuck advances the wire solder, and as a result, the wire solder is buckled between the chuck and the wire solder.

A wire delivering device to deliver a wire formed of a flexible material delivers the wire by an openable/closable and longitudinally movable chuck body. A pipe is provided on at least one side of the chuck body in the longitudinal direction, and the wire is passed through the chuck body through the pipe. The chuck body and the pipe are interlocked with each other, and an end part of the pipe is covered by a holding means to slightly hold the wire.