Title:
WIRE DRAWING DIE
Document Type and Number:
Japanese Patent JP2012187594
Kind Code:
A
Abstract:
To provide a wire drawing die 1 with which tensile residual stress generated on the surface of a metal wire after wire drawing is suppressed.
There is provided the wire drawing die 1 in which a die hole 2 including a reduction part 5 and a bearing part 6 is formed, and the surface of the reduction part is mirror-finished and the surface of the bearing part is made rougher than the mirror finishing. The surface roughness of the surface of the reduction part 5 is <1.40 μm in ten point average roughness Rz and <0.19 μm in a center line average roughness Ra. The surface roughness of the bearing part 6 is 1.40-1.90 μm in a ten point average roughness Rz and 0.19-0.28 μm in a center line average roughness Ra.
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Inventors:
FUJIWARA NOBUHIKO
AMANO HIROTAKA
ITO KIMIHIKO
KAWAMURA SHUNYA
AMANO HIROTAKA
ITO KIMIHIKO
KAWAMURA SHUNYA
Application Number:
JP2011051349A
Publication Date:
October 04, 2012
Filing Date:
March 09, 2011
Export Citation:
Assignee:
KANAI HIROAKI
International Classes:
B21C3/02; B21C3/06
Attorney, Agent or Firm:
住友 教郎
室橋 克義
岡 憲吾
笠川 寛
室橋 克義
岡 憲吾
笠川 寛