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Patent Searching and Data


Title:
WIRE HEIGHT INSPECTION IN WIRE BONDING
Document Type and Number:
Japanese Patent JPH1163932
Kind Code:
A
Abstract:

To inspect the height of wire efficiently after wire bonding.

A wire 6 is shot with the focus of a camera 8 fixed at a reference height to obtain the brightness distribution of the wire 6 in a cross direction from the obtained wire image. The degree of fuzziness is numericallyexpressed by the brightness distribution, and the relation between the numerically-expressed result and dislocation amount from the reference height in a height direction is obtained previously as a height conversion table. For wire height inspection, the dislocation amount is obtained from the height conversion table based on the fuzziness degree of the wire image, therefore, the height of the wire 6 can be obtained without any adjustment of the focus to the wire 6 at every time by moving the camera 8 vertically, thus it is possible to conduct wire height inspection after wire bonding promptly.


Inventors:
KUSUKI HIRONORI
MATSUZAKI HIROFUMI
Application Number:
JP22782597A
Publication Date:
March 05, 1999
Filing Date:
August 25, 1997
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01D1/18; G01B11/02; H01L21/60; (IPC1-7): G01B11/02; G01D1/18; H01L21/60
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)