To provide a stable and low wire loop form and the wire loop form having little damage at a neck height part, a wire bonding method, a semiconductor manufacturing apparatus for applying the method and a semiconductor device having the wire loop form.

In the wire loop form for connecting between a first bonding point and a second bonding point with a wire, the pinnacle of the ball at the first bonding point including a part of the wire is made to be squashed. The forming method for connecting between the first bonding point and the second bonding point with the bonding wire comprises a first process for connecting the wire to the first bonding point, a second process for controlling the wire loop by moving a capillary upward, horizontally, etc., a third process for bonding the wire to the vicinity of the pinnacle of the bonded ball at the first bonding point A, and a fourth process for sending out the wire toward the second bonding point and connecting the wire to the second bonding point Z while controlling the wire loop by moving the capillary upward, horizontally, etc.