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Patent Searching and Data


Title:
WIRE MATERIAL ARRAYING METHOD
Document Type and Number:
Japanese Patent JPS5598764
Kind Code:
A
Abstract:

PURPOSE: To make possible arraying of a desired number of needle-form electrode connecting wires with a selected wire by installing a wire arraying table between two sets of opposing pin groups of the specified pitch and spreading the wire with a deviation of the wire by each specified pitch between the opposing pins.

CONSTITUTION: Double-coated adhesive tapes 361, 362 are affixed to the head base 4 which forms the wire arraying table between two sets of pin groups such as pins 71n and 72n, 81n and 82n... opposing at the specified pitch. Thence, the wire 11 selected by the 2nd scanning table 17 provided with a wire feed head 14 is moved together with the 1st scanning table 15 in the direction rectangular to the table 15 and is spread between the pins 71n, 72n..., 81n, 82n... at the specified pitch and is fixed to the tapes 361, 362 as the stop position of the table 15 is controlled at the desired pitch by a differential micrometer 5. Hence, the needle-form electrode connecting wire materials may be well arrayed so as to become the desired number within the specified section at the desired pitch by a small number of wires without selecting multiple wires.


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Inventors:
ISHIMA KAZUMI
Application Number:
JP588879A
Publication Date:
July 28, 1980
Filing Date:
January 20, 1979
Export Citation:
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Assignee:
RICOH KK
International Classes:
G03G15/05; B41J2/395; G03G15/00; (IPC1-7): B41J3/18; G03G15/00