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Patent Searching and Data


Title:
WIRE MATERIAL LAYING DEVICE
Document Type and Number:
Japanese Patent JPH01288574
Kind Code:
A
Abstract:

PURPOSE: To reduce sliding resistance of a wire material and constrain the seizure and flaw of the wire material by forming a wire material laying head pipe with a pipe main body and a ring-state member having lubricity.

CONSTITUTION: With a wire material laying head pipe 17 rotated around the axis core of a virtual circular cone with a drive part, a wire material is intro duced from the lead-in port 18 of the pipe 17, the wire material is passed to the guide hole connecting the port 18 and a lead-out port, and curvedly processed in a coil state. When the wire material passes the guide hole, the outer surface of the wire material touches the lubricious inner periphery wall surface of ring-state members (carbon ring) 60 and 61 retained within the main body 21 of the pipe 17. This causes the slide resistance between the wire mate rial and the pipe 17 to be lowered, and the seizure and flow of the wire material constrained.


Inventors:
TERAOKA TADANORI
MATSUE KATSUHITO
HASEGAWA TAMOTSU
ASO KAORU
Application Number:
JP24344287A
Publication Date:
November 20, 1989
Filing Date:
September 28, 1987
Export Citation:
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Assignee:
AICHI STEEL WORKS LTD
International Classes:
B65H54/82; (IPC1-7): B65H54/82
Attorney, Agent or Firm:
Hiroshi Okawa