Title:
WIRE MODULE
Document Type and Number:
Japanese Patent JP2001110247
Kind Code:
A
Abstract:
To provide a wire module for ensuring connection to an accessory provided in a vehicle body, when wired in the vehicle body as a movable body.
A wire module 1 comprises a FPC 10, a connector 11 and a plate spring 25. The FPC 10 formed in a band shape has a plurality of conductors 12 in parallel. The connector 11 has a boxed housing 21 and a female terminal 22 stored in the housing 21. The plate spring 25 connects the conductor 12 to the female terminal 22. The plate spring 25 allows the FPC 10 and the housing 21 to be displaced from each other along the cross direction of the FPC 10.
Inventors:
SASAKI HISANORI
Application Number:
JP28959099A
Publication Date:
April 20, 2001
Filing Date:
October 12, 1999
Export Citation:
Assignee:
YAZAKI CORP
International Classes:
H01R13/14; H01B7/00; H01B7/08; H02G3/30; H02G15/02; (IPC1-7): H01B7/08; H01R12/24; H01R13/14; H02G3/30; H02G15/02
Attorney, Agent or Firm:
Hideo Takino (1 outside)
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