Title:
WIRE MONITORING SYSTEM FOR WIRE SAW AND METHOD FOR MONITORING WIRE SAW
Document Type and Number:
Japanese Patent JP2015003383
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wire monitoring system for a wire saw, the wire saw, and a method for monitoring a wire of the wire saw.SOLUTION: A wire monitoring system 10 for a wire saw 100 includes: a sensor device 50; a first wire positioning system 21 which moves a first wire from a first position of the first wire to a second position of the first wire; and a first wire holding arrangement 41 which is formed so as to hold the first wire at the second position to measure physical characteristics of the first wire by using the sensor device 50.
Inventors:
CLAUDE ZOMINY
SCHMID ANDREAS
SCHMID ANDREAS
Application Number:
JP2014127032A
Publication Date:
January 08, 2015
Filing Date:
June 20, 2014
Export Citation:
Assignee:
APPLIED MATERIALS SWITZERLAND SA
International Classes:
B24B27/06; B28D5/04; H01L21/304
Attorney, Agent or Firm:
Yoshitaka Sonoda
Yoshinori Kobayashi
Yoshinori Kobayashi